Peichun Hua | CUHK-Shenzhen

About Me

I am a final-year Computer Science student at the School of Data Science, The Chinese University of Hong Kong, Shenzhen (CUHK-Shenzhen). I was an exchange tar heel at the University of North Carolina at Chapel Hill in Year 2024-25.

My research interests lie at the intersection of computer security, machine learning, and hardware security. I am fortunate to work with Prof. Yue Zheng and Prof. Yunming Xiao at CUHK-Shenzhen. In the summer of 2025, I was a participant of International Student Research Internship Program at Washington University in St. Louis, advised by Prof. Ning Zhang.

Publications

A Unified Open-Set Framework for Scalable PUF-Based Authentication of Heterogeneous IoT Devices

Xin Wang, Peichun Hua, Chip Hong Chang, Wenye Liu, Yue Zheng

arXiv preprint. arxiv

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@article{wang2026openpuf, title={A Unified Open-Set Framework for Scalable PUF-Based Authentication of Heterogeneous IoT Devices}, author={Xin Wang and Peichun Hua and Chip Hong Chang and Wenye Liu and Yue Zheng}, year={2026}, eprint={2605.07340}, archivePrefix={arXiv}, primaryClass={cs.CR}, url={https://arxiv.org/abs/2605.07340}, }

Rethinking Jailbreak Detection of Large Vision Language Models with Representational Contrastive Scoring

Peichun Hua, Hao Li, Shanghao Shi, Zhiyuan Yu, and Ning Zhang

The 64th Annual Meeting of the Association for Computational Linguistics (ACL), 2026. ACL

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Accepted as Oral Presentation of Main Conference (Top 20% of Accepted Papers). Acceptance Rate: around 2300/12148 ≈ 19%.

@article{hua2025rethinking, author = {Hua, Peichun and Li, Hao and Shi, Shanghao and Yu, Zhiyuan and Zhang, Ning}, journal = {ArXiv preprint}, title = {Rethinking Jailbreak Detection of Large Vision Language Models with Representational Contrastive Scoring}, url = {https://arxiv.org/abs/2512.12069}, volume = {abs/2512.12069}, year = {2025} }

Live Demonstration: Hardware-Bound IP Protection for Edge-deployed Transformers

Peichun Hua, Hanxiu Zhang, Tuo Li, Yue Zheng, and Wenye Liu

IEEE International Symposium on Circuits and Systems (ISCAS), 2026. ISCAS

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Accepted for Live Presentation.

@inproceedings{hua2026live, title={Live Demonstration: Hardware-Bound IP Protection for Edge-deployed Transformers}, author={Hua, Peichun and Zhang, Hanxiu and Li, Tuo and Zheng, Yue and Liu, Wenye}, booktitle={IEEE International Symposium on Circuits and Systems (ISCAS)}, year={2026}, organization={IEEE} }

Securing On-device Transformer with Hardware Binding and Reversible Obfuscation

Peichun Hua, Hanxiu Zhang, Tuo Li, and Yue Zheng

The 41st Annual Computer Security Applications Conference (ACSAC), 2025. ACSAC

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Acceptance Rate: 84/446 ≈ 18.8%. Artifact Available, Artifact Reviewed, Artifact Reproducible (IEEE Badges, 34/84 among accepted papers).

@inproceedings{hua2025securing, title={Securing On-device Transformer with Hardware Binding and Reversible Obfuscation}, author={Hua, Peichun and Zhang, Hanxiu and Li, Tuo and Zheng, Yue}, pages={956-972}, booktitle={2025 IEEE Annual Computer Security Applications Conference (ACSAC)}, year={2025}, organization={IEEE}, keywords={Deep learning;Computational modeling;Intellectual property;Transformers;Physical unclonable function;Hardware;Software;Data models;Protection;Software development management;Intellectual Property;Transformer;Model Stealing Attacks;Physical Unclonable Functions}, doi={10.1109/ACSAC67867.2025.00079}} }

Services

2025

Awards

Academic Honors

Dean's List, School of Data Science, CUHK-Shenzhen — 2022–2023, 2023–2024
Academic Performance Scholarship (Class B, Top <2%), School of Data Science — 2023–2024
Academic Performance Scholarship (Class C, Top <5%), School of Data Science — 2022–2023
University Research Award (with scholarship) — 2024 Fall, 2025 Spring

Research Awards

Student Conferenceship, 41st Annual Computer Security Applications Conference (ACSAC 2025) — Dec. 2025
Artifact Available, Artifact Reviewed, and Artifact Reproducible Badges — IEEE — for paper 'Securing On-device Transformer with Hardware Binding and Reversible Obfuscation' at ACSAC 2025
Fully Funded International Research Internship — McKelvey School of Engineering, Washington University in St. Louis — Summer 2025